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DRPS : Course Catalogue : School of Engineering : Postgrad (School of Engineering)

Postgraduate Course: Microfabrication Techniques (PGEE11038)

Course Outline
SchoolSchool of Engineering CollegeCollege of Science and Engineering
Credit level (Normal year taken)SCQF Level 11 (Postgraduate) AvailabilityNot available to visiting students
SCQF Credits10 ECTS Credits5
SummaryThis module will examine the fabrication processes employed in the manufacture of microelectronic devices and microsystems. Initial lectures will cover the well established, industry standard steps used in silicon CMOS technology. The basic science underlying the individual process steps will be presented, along with key aspects of manufacturing and production strategies. Building on this knowledge base, students will study the enabling technologies required for future advanced MEMS devices and microsystems. The lectures will not be exclusive to silicon processing, but will also examine increasingly important areas such as plastic and organic electronic device manufacture. The cleanroom facilities of the Scottish Microelectronics Centre, based at the University of Edinburgh, will allow students a unique, first-hand experience of a diverse microfabrication toolset, providing the ideal backdrop to this MSc course.
Course description Lectures: (1) Course Introduction; (2) Cleanroom Health and Safety
Exercises: (1) 30 minute tour of the cleanroom services; (2) half day cleanroom visit to experience the microfabrication toolset

Semester 2
The lecture course is split into three segments:
Segment A Silicon Integrated Circuit Fabrication Techniques
(1) Processing Overview; (2) Silicon; (3) Layer Formation I; (4) Layer Formation II; (5) Lithography & Patterning I; (6) Lithography & Patterning II; (7) Etching Techniques I; (8) Etching Techniques II; (9) Layer Formation III; (10) Layer Formation IV; (11) Back-end Processing; (12) Test Structures.
Segment B MEMS/Microsystems Fabrication Techniques
(13) MEMS Process Integration; (14) 3-D Structure Fabrication; (15) Wafer Bonding; (16) Integrating MEMS with CMOS; (17) Metrology Techniques; (18)MEMS Device Examples
Segment C Case Studies
Lectures (19) and (20) are given by guest lectures from industry who will discuss what is involved in microsystem design, fabrication and optimisation and what is involved in taking a product to market. Past contributors have included Wolfson Microelectronics and Microemissive Displays.

Tutorials: there are ten 50-minute tutorial sessions scheduled in semester 2. Revision sessions will be timetabled as required past years have seen two 2-hour revision sessions
Entry Requirements (not applicable to Visiting Students)
Pre-requisites Co-requisites
Prohibited Combinations Other requirements None
Course Delivery Information
Not being delivered
Learning Outcomes
The students will receive an essential overview of the IC and microsystem fabrication industry, and be able to understand: the principles behind the design and fabrication of both semiconductor and MEMs devices and the effect of processes on their performance; a thorough understanding of the available fabrication technologies; a good working knowledge of possible process architectures; an appreciation of the process plant required to enable microfabrication of devices and systems.
Reading List
Recommended Reading

Introduction to Microfabrication by S. Franssila (Wiley)
Fundamentals of Microfabrication by M. Madou (CRC Press)

Additional Texts (more advanced texts for the interested student)

ULSI Technology by C.Y. Chang & S.M. Sze (McGraw-Hill)
CMOS Processing for the VLSI Era by S. Wolf & R.N. Tauber (Lattice)
Fundamental Principles of Optical Lithography by C. Mack (Wiley)
Additional Information
Graduate Attributes and Skills Not entered
KeywordsSilicon Processing,deposition,etching,photolithography,MEMS,Microsystems,microfluidics,more t
Course organiserDr Jonathan Terry
Tel: (0131 6)50 5607
Course secretaryMrs Megan Inch-Kellingray
Tel: (0131 6)51 7079
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